| 摘要 |
PURPOSE:To ensure mechanical and electrical connections by joining a chip to a substrate by hardening adhesives under the condition that an electrical connection is secured by pressing. CONSTITUTION:Adhesives 36 are applied on the upper surface of a chip 1, the chip 1 is pressed on a substrate 3 and the bump contact 2 of the chip 1 is pressed and jointed to the lead 4 of the substrate 3. In this case, the adhesives 36 are perfectly removed from between the bump contact 2 and the lead 4 by pressing power and the bump contact 2 is elastically pressed on the surface of the lead 4 as if encroaching in the surface, an electrical connection is secured, simultaneously a worktable 14 is moved transversely and an ultraviolet rays irradiating device 17 is positioned directly upon the chip 1 facing to the chip, the adhesives 36 are hardened by being irradiated with ultraviolet rays via the through hole 13 of the substrate 3 and the transparent substrate 3 and the chip 1 is fixed on the substrate 3. These maintain a state of pressed jointing and the electrical connection of the bump contact 2 and the lead 4 is surely maintained.
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