| 摘要 |
PURPOSE:To improve the bonding strength between a substrate and an electrode and the workability by bringing a member propagating an ultrasonic wave to the surface or end face of the substrate in contact with an electrode pattern and a metallic wire of the surface of substrate so as to apply ultrasonic wave bonding. CONSTITUTION:An electrode pattern 2 is formed to a surface 1a of a substrate 1 and after a rear face 1b is fixed to a stem 4 via an adhesives 3, a tip of a lead pin implanted with the stem 4 and one end of a metallic wire 6 are subjected to ultrasonic bonding by pressing the tip of a capillary 7 into contact therewith. Then an electrode pad of an interdigital electrode 2a and the other end of the metallic wire 6 are pressed into contact with the tip of the capillary 7 to apply ultrasonic wave bonding. In this case, both end faces 1c, 1c of the piezoelectric substrate 1 are clipped to a degree that the piezoelectric substrate 1 by the ultrasonic wave bonding is not vibrated by using contact terminals 9, 9 made of the member such as a metal through which ultrasonic wave energy is propagated. Thus, the ultrasonic wave bonding connection is applied by providing a power of a required minimum ultrasonic energy and the bonding strength between the piezoelectric substrate and electrode pattern and the workability are improved.
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