发明名称 ION PLATING DEVICE
摘要 PURPOSE:To obtain an ion plating device wherein the adhesion properties of an adhesive film formed on the surface of a base material are enhanced and control of film quality is facilitated by providing an ion source projecting high- energy ions on the surface of the base material to the inside of a vacuum chamber of the ion plating device. CONSTITUTION:After regulating the inside of a vacuum chamber 1 to a high- vacuum state, high-energy ions such as Ar<+> are projected on the surface of a base material 2 by actuating a high-energy ion source 8 and simultaneously ion plating treatment is performed by an evaporation source 4 like a conventional method. Thereby mixed layers 9 or 10, 11 of both the atom of high-energy ions and the atom of the base material 2 are formed on the surface of several hundreds - several thousands Angstrom of the base material 2. An adhesive film 12 is formed on the mixed layers by same ion plating treatment as the conventional method by actuating the evaporation source 4, or an adhesive film 13 mixed with both the atom of the film 12 and the atom of high-energy ions is formed thereon by actuating the ion source 8.
申请公布号 JPS63128170(A) 申请公布日期 1988.05.31
申请号 JP19860272788 申请日期 1986.11.18
申请人 ULVAC CORP 发明人 TAGOME KUNIHIKO;TAKAHASHI NATSUKI
分类号 C23C14/32 主分类号 C23C14/32
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