| 摘要 |
PURPOSE:To obtain the title device capable of rapidly removing foreign matter and preventing the deposition of foreign matter on a material to be treated during etching by boring many holes through the upper part of the inner vessel of a treating vessel, and removing suspended foreign matter from the holes and the upper part of the inner vessel into an outer vessel. CONSTITUTION:Pure water and hydrochloric acid are respectively supplied 3 and 4 into the treating vessel 1, and kept at a set temp. by a heat exchanger 2. When the material 14 to be treated is etched, a processing soln. 7 is sent to the inner vessel 12 of the treating vessel 11 through a filter 10. When the inner vessel 12 is filled with the supplied processing soln. 7 to overflowing, the material 14 to be treated and a carrier 15 are dipped in the processing soln. 7 in the inner vessel 12, and etching is carried out for a set time. At this time, the processing soln. 7, from which suspended matter has been removed by the filter 10, is always circulated and supplied from the bottom of the inner vessel 12, and sent into the outer vessel 13 from many holes 12a provided to the inner vessel 12 and the upper part of the inner vessel 12. The processing soln. 7 sent into the outer vessel 13 is supplied 19 to the storage vessel 1 from the bottom of the outer vessel 13. As a result, foreign matter can be rapidly removed, and the deposition of foreign matter of the material to be treated during etching can be prevented.
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