| 摘要 |
PURPOSE:To enable separating a resist which has difficulty of being separated by combining a mechanical separation and a chemical separation using a brush and a separating liquid. CONSTITUTION:A wafer chuck table 17 for placing a sample (wafer) 11 in a cup 12 is turned by a spin motor 16, a brush 13 which is brought into contact with the sample 11 at a controlled pressure is turned at a different speed from the rotation speed of the sample, the brush 13 is turned in contact with the sample 13 in correspondence to the rotation of the spin motor 16 and is moved to one direction, and upon reaching the end, it is separated from the sample 11 and is washed. This perfectly removes the resist film on a wafer even if a degenerated layer is formed on the surface of the resist film and the operation of a wafer process can be improved. |
