MOUNTING DEVICE OF COMPONENTS

摘要

Replaceable hoppers are mounted on the upper part of the device. The column type chip components in which the electrodes (Cb) are formed on the both sides of an insulation are placed in the hoppers. The plastic pipes are provided to link the hoppers on the mount with the positioning plate. If a chip component is supplied, the chip component is guided to the plastic pipe and is dropped into the holes of the upper plate and lower plates (11, 10).