| 摘要 |
PURPOSE:To prevent the generation of burr in the peripheral section of a semiconductor substrate by densely coating the periphery of the semiconductor substrate with an insulator before a bump is formed through plating. CONSTITUTION:The peripheral section of a semiconductor substrate is coated densely with an insulator on plating for shaping a bump through sealing working by a resin 4 or the fitting of an O ring consisting of a rubber in the periphery of an silicon board 1, and creeping to the rear from the periphery of the substrate of a blow-up plating solution is obviated, thus preventing the generation of burr. Accordingly, trouble by burr in a photoprocess in a post-process is not generated, and the peeling of the burr and its adhesion onto the surface of the substrate and the damage of the characteristics of a semiconductor device are prevented, thus improving the reliability of the semiconductor device.
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