| 摘要 |
PURPOSE:To ensure the removal of a foreign matter and to improve the yield of a product by providing on the device the suction means to remove the foreign matter caused at working time with its suction. CONSTITUTION:A vacuum suction cleaner 2 is provided inside the main body 1 of a working device and a loader part 3 and unloader part 4 are arranged as well. The suction port 2a of the cleaner 2 is opened in the necessary number only on the upper face of the die 5 at the lower side. When the semiconductor device to be cut is transferred to the die 5 through a feeder 6 from the loader part 3, the die 5 at the upper side is descended to perform a cutting and the foreign matter of the resin chip, metal chip, etc., caused at that time are removed by being fed to the dust collecting chamber of the cleaner main body 2b through a suction path 2c from the suction port 2a of the cleaner 2. With this method, the foreign matter is surely removed without splashing and the generation of a defective product due to the sticking of a foreign matter can be prevented as well. Consequently the yield of product is improved.
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