| 摘要 |
PURPOSE:To calculate positions of a positioning target and a fuse piece correctly, by forming the upper layer of the target of a metal having a high reflectivity with respect to laser light while forming the lower layer of the same material as the fuse. CONSTITUTION:In order to position a fuse piece 7 for cutting it with laser light, a wafer 3 is irradiated with laser light and the laser light is scanned in the X- and Y-directions so that variance in reflectivity thereof is detected. The upper layer 1b of a target 1 is composed of a metal having a high reflectivity with respect to the laser light. Therefore, the position of the target 1 can be detected easily. The position of a fuse piece 7 connected to a defective circuit is calculated from a distance between a fuse pattern formed in a part of a gate electrode forming mask and the target pattern. The predetermined fuse piece is cut by applying laser light and the circuits are switched over.
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