| 摘要 |
A bonder for sequentially bonding a plurality of semiconductor bodies carrying integrated circuits and having contact pads thereon to a respective plurality of lead structures formed in a sheet of material. The sheet of material is retained in a frame which is sequentially indexed to position each of the lead structures in a bonding position. Semiconductor bodies are picked up from storage by a pick up arm and placed on a transport arm. The transport arm is adapted to then shift to a bonding position whereby the semiconductor body on the transport arm is approximately coaxially aligned with the lead structure in the bonding position. Optical viewing apparatus is provided for viewing the lead structure in the bonding position and the semiconductor body retained on the transport arm in the bonding position. The transport arm is mounted on a micromanipulator apparatus by means of which the transport arm and hence the semiconductor body carried thereon may be rotated or translated in order to align the contact pads on the semiconductor body with the lead structure. A clamp is provided for clamping the lead structure to the semiconductor body after alignment and a bonding energy source such as a torch is moved into position to bond the semiconductor body to the lead structure.
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