INSPECTING METHOD FOR SOLDERING STATE

摘要

PURPOSE:To perform inspection processing in a short time by extracting corresponding data from image data on a substrate to be inspected based on coordinate data regarding a place to be inspected, and inspecting a soldering state. CONSTITUTION:A surface to be soldered is masked except at a place 1a to be soldered and the masked substrate is used as a master substrate 1. Then, the image of the masked surface of the substrate 1 is picked up through optical systems 3-5 for video photography and coordinate data on the place 1a is found from the obtained image data and stored on a proper storage medium 6. Then the image of the soldered surface of a substrate 2 which is already soldered is picked up and the obtained image data is supplied to an image processor 7. The processor 7 is supplied with the coordinate data on the place 1a which is read out of the storage medium 6 and image data on a place 2a corresponding to the place 1a is extracted from the image data on the substrate 2 to be inspected on the basis of the supplied coordinate data to inspect the soldering state.