发明名称 WIRE BONDER
摘要 PURPOSE:To dispense with alignment by an operator by a method wherein bonding positions are detected and the bonding is performed in accordance with the detected values and the position of the cut edge of a wire is obtained and the wire is cut. CONSTITUTION:Pattern recognition of the pictures of a terminal 14 and a lead 12 is performed to obtain the center coordinates of the terminal 14 and the lead 12. Then the crossing angle theta between a bonding wire and the X-axis is obtained from those coordinates. Then a theta table 3 is turned by the crossing angle theta and a Y-table 5 is moved to transfer a tool 6 to the position above the bonding wire. In this state, the center coordinates of the terminal 14 and the lead 12 are obtained by calculation and the tool 6 is transferred by an X-table 5 and 1st bonding is carried out. After that, the tool 6 is transferred to the position above the center point of the lead 12 and 2nd bonding is carried out. Then the coordinates of a lead edge are calculated from the coordinates of the terminal 14 and the lead 12 and the tool 6 is transferred to the position above the lead edge and, if the tool 6 is made to descent by a Z movement device 7, the bonding wire is cut by shearing.
申请公布号 JPS63124430(A) 申请公布日期 1988.05.27
申请号 JP19860268580 申请日期 1986.11.13
申请人 MARINE INSTR CO LTD 发明人 MIYOSHI HIDEAKI
分类号 H01L21/60 主分类号 H01L21/60
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