发明名称 LASER BEAM MACHINING FOR THIN FILM BODY
摘要 PURPOSE:To perform a cutting or piercing in a complicated shape on a thin film body at high speed and with good accuracy by projecting a laser beam on the surface of a thin film body after forming the layer having higher reflection factor than that of the thin film body for the laser beam. CONSTITUTION:The laser beam 1 emitted from a CO2 gas laser oscillator 2 is passed through a condensing lens 4 after being reflected by a reflection mirror 3, condensed on an evaporation film 5 and the prescribed work is performed. When the laser beam 1 is projected on a metal layer 10, the majority of the laser beam is reflected and even whose beams which are not reflected can be used up for removing the metal layer. Consequently, only the part where no metal layer 10 of a resin film 9 is formed can be subjected to a cutting or piercing.
申请公布号 JPS63123590(A) 申请公布日期 1988.05.27
申请号 JP19860269107 申请日期 1986.11.12
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NISHIKAWA YUKIO;MAKINO MASASHI;UESUGI YUJI
分类号 B23K26/18 主分类号 B23K26/18
代理机构 代理人
主权项
地址