发明名称 METHOD FOR SOLDERING MULTITERMINAL CHIP PART FOR SURFACE PACKAGING ON PRINTED CIRCUIT BOARD AND SOLDERING IRON
摘要 PURPOSE:To improve a soldering efficiency, etc., by providing the comb-tooth type heating pinch arm having the recessed groove for terminal on a soldering iron and arranging a terminal correction device as well as soldering a multiterminal chip part via soldering iron and suction nozzle pipe. CONSTITUTION:The front and back, right and left heating and pinching arms 3 are provided in a comb-tooth shape on the base body 2 of a soldering iron 1 and the groove 6 for terminal is formed at the specified intervals on the pinching arm 3 as well. On the other hand, a receiving panel 13 and correction guide mechanism 14 are provided on a terminal correction device 12 and the changeable receivor 13d equipped with a recessed place 13e is arranged on the receiving panel 13. Terminal groups B1, B2 are pinched by the pinching arm 3 by descending the base body 2 of the soldering iron 1, terminals C, C' are corrected between the upper faces of the recessed groove 6 and receiving panel 13 and a soldering is performed in the state of the adsorption by the nozzle pipe 4 for transfer adsorption. With this method, a correct soldering is quickly performed, so the soldering efficiency and its accuracy are improved.
申请公布号 JPS63123563(A) 申请公布日期 1988.05.27
申请号 JP19860268273 申请日期 1986.11.11
申请人 YAGI KINSAKU 发明人 YAGI KINSAKU
分类号 B23K3/00;B23K1/00;B23K3/02;B23K3/04;H05K3/34 主分类号 B23K3/00
代理机构 代理人
主权项
地址