| 摘要 |
PURPOSE:To easily remove a resin after forming an electroless copper plating pattern by incorporating a binder component composed of a photosensitive component and a polymer having a tertiary or the secondary amine to the titled composition. CONSTITUTION:The photosensitive component comprises a compd. having vinyl, aryl or methacryl group, etc. The binder component comprises the polymer having the tertiary amine or the secondary amine, such as the polymer of vinyl pyridine, vinyl imidazole, vinyl pyrolidone, or N,N-dimethyl acrylamide, etc. The titled composition is produced by mixing the photosensitive material and the binder component, and the photosensitive material is formed by said material. The copper pattern is formed on a substrate by forming the electroless copper plating pattern to the photosensitive material, followed by dipping it in an acidic solution to remove the resin. Accordingly, as said binder component is used as the binder, the binder has an excellent durability for the electroless copper plating bath and is easily removed, and enables to make the fine copper wiring pattern. |
