发明名称 SEALING APPARATUS FOR SEMICONDUCTOR WITH RESIN
摘要 PURPOSE:To make an apparatus small in size by providing a mechanism whereby an unnecessary part after sealing is removed from a product in a molding die. CONSTITUTION:A clamp mechanism 3 is lowered onto a molding die 50, and pawls 4 for takeout clamp the lead frame 102 of a product 100 on the die 50 from the opposite end sides. A suction pad 5 is lowered also on the occasion and presses down a part 101 of the product 100 which is unnecessary after sealing thereof. When a floating base 2 is elevated subsequently, the clamp mechanism 3 is moved and inclined in the direction of an arrow B around a stop pin 10 operating as a fulcrum, being guided by a guide cam 8, and the product 100 is also inclined. At this time, the unnecessary part 101 pressed down by the pad 5 is separated from the product 100 by this inclination. The apparatus can be made small in size thereby, and the rate of operation thereof is improved by the simplification of the mechanism thereof.
申请公布号 JPS63124426(A) 申请公布日期 1988.05.27
申请号 JP19860270190 申请日期 1986.11.12
申请人 NEC KYUSHU LTD 发明人 FUKUMOTO YOSHINARI
分类号 B29C37/02;B29C45/02;B29C45/14;B29C45/38;B29L31/34;H01L21/56 主分类号 B29C37/02
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