| 摘要 |
PURPOSE:To transport wafers between both cassettes, the pitches of wafer receiving grooves thereof mutually differ, by forming laminated wafer transport paths by elastic diaphragms and conforming pitches at both ends to those of the grooves for both cassettes severally transported. CONSTITUTION:Elastic films 5a each have penetrating holes 6 long in the vertical direction, and four support shafts 7 penetrated into the penetrating holes 6. Spacers 8a and 8b having different outer diameters for determining the pitches of the openings (a), (b) of the port openings of wafer transport paths A for semiconductor wafers are each held in a series shape under a spitting state by the four support shafts 7. Accordingly, the device can flexibly correspond to not only transport into a cassette having pitches in the multiple of groove pitches of one cassette or the reciprocal of the multiple but also transport to a cassette having irregular pitches from a cassette having regular ones. |
