| 摘要 |
PURPOSE:To be able to efficiently measure high density, multiple pins and high speed electric characteristics of a semiconductor element by securing a structure having characteristic impedance with spring property and movably at core wirings of a coaxial cable to a substrate of a conductive material formed with a through hole at the position corresponding to the electrode for measuring the electric characteristics of the element. CONSTITUTION:Tungsten probes 14 having a diameter of wirings slightly smaller than the inner diameter of a hollow cylindrical Teflon 13 shielded by copper winding 12 at the outside are inserted into the Teflon 13 to form a coaxial cable of a structure having a specific impedance of movable tungsten probes 14. One end of the coaxial cable is inserted into a substrate 16 of conductive material, such as copper or brass formed with a through hole corresponding to the position of the electrode 15 for measuring the electric characteristics of a semiconductor element to be connected by soldering. The other end of the cable is connected to a coaxial connector 20 connected at its spring probes 17 impedance-matched to the probes 14 to be connected to an inspecting circuit, buried in the same material 19.
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