| 摘要 |
PURPOSE:To enhance the accuracy of bonding alignment and, at the same time, to make the distribution of a bonded layer uniform by a method wherein a protective film layer is formed on a transparent glass substrate where monochromatic filters or color-separating filters are formed at prescribed intervals and light-receiving parts at a wafer for a solid-state image pickup device are bonded and fixed through a bonded resin layer in such a way that the light-receiving parts are aligned with the respective monochromatic filters or the color- separating filters. CONSTITUTION:Chip-like color-separating filters 2 are formed on the surface of a transparent glass substrate 1 at prescribed intervals; in addition, a protective film layer 3 is formed on the transparent glass substrate 1 and the color-separating filters 2. Then, grooves 1 ' are made between the color-separating tilters 2 by making use of a dicing saw in such a way that the grooves do not touch bonding pad parts 8. Then, the respective light-receiving parts 6 at a water 5 for a solid-state imaging device are bonded and fixed to the transparent glass plate 1 and the protective film layer 3 by means of an aligner through a bonded resin material 4' which is transformed into a bonded resin layer 4 in such a way that the light- receiving parts 6 are aligned with the color-separating filters 2. Then, one face is polished by using cerium so as to obtain an optical mirror-plane. Then, the protective layer 3 and the bonded resin layer 4 are removed by using an O2 plasma solvent; after that, the assembly is cut by means of the dicing saw and is processed. |
