发明名称 HANDLER FOR TESTING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 PURPOSE:To enhance the positioning accuracy of leads of an SO package with reference to contact pins and to prevent the leads of the SO package from being bent by a method wherein more than one contact pin is mounted in the prescribed positions at a contact guide-rail and these contact pins come into contact with the leads of the SO package in such a way that they sandwich the leads from the upper part and the lower part. CONSTITUTION:Contact pins 2 are mounted, through driving rods 6, on a contact guide-rail 1 consisting of a gliding path 1a and guide rails 1b. An SO package 3 which has been transferred from a loader part glides inside the contact guide- rail 1 while it is guided by the guide rails 16. During this process, the SO package 3 is positioned by the contact guide-rail 1. When it is guided to the contact pins 2 by keeping the positioned state, it comes into contact with a stopper pin 4 and it is stopped. Then, the contact pins 2 are pressed by upper and lower driving rods 6, and come into contact with the flat part of leads 5 of the SO package in such a way that the leads are sandwiched between the upper and lower contact pins.
申请公布号 JPS63122142(A) 申请公布日期 1988.05.26
申请号 JP19860268294 申请日期 1986.11.11
申请人 MITSUBISHI ELECTRIC CORP 发明人 UEDA KIYOTOSHI
分类号 H01L21/66;G01R31/26 主分类号 H01L21/66
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