发明名称 INTEGRATED CIRCUIT
摘要 PURPOSE:To allow a black body to approach a perfect black body in heat- radiating capability by several to approximately 20% for an improved heat radiating feature, reduced size, and enhanced reliability in an integrated circuit by a method wherein a metal cap is blackened. CONSTITUTION:A metal cap is blackened so that it may approach a perfect black body in its heat-radiating capability. Such a blackened cap may be built by fabricating into a cap a material that has been carbonized before fabrication, the material may be carbonized after fabrication into a cap, or the surface of the metal cap may be blackened after being seam-welded to a package. Illustrated as an example is a dual in-line package provided with a ceramic portion 1, pins 2, and a metal cap 3 that has been colored black.
申请公布号 JPS63122251(A) 申请公布日期 1988.05.26
申请号 JP19860270165 申请日期 1986.11.12
申请人 NEC CORP 发明人 SUGAWARA YASUYOSHI
分类号 H01L23/34;H01L23/02;H01L23/04 主分类号 H01L23/34
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