| 摘要 |
PURPOSE:To avoid the situation that a solder material during a soldering process aud a stress to be caused during thermal expansion and contraction of a holder affect a window glass part by a method wherein the inner part of the support material is shaped with a big inner size and a small inner size, a package for a light-emitting device or a photodetector is inserted in such a way that its window side is situated at the big inner size and the part of the small inner size is fixed by soldering. CONSTITUTION:The inner part of a holder material 6 is shped with a big inner size 9 and a small inner size 10. A package 5 for a light-emitting device or a photodetector is inserted into the holder material 6 in such a way that the side of a window glass plate 7 is situated at the big inner size 9 while the part of the small inner size 10 is fixed by soldering. By this method, there occurs a gap between the part near the window glass plate 7 and the part at the big inner size 9 of the holding material 6. Thanks to this gap, a solder material 8 during a soldering process and a stress to be caused by thermal expansion and contraction of the holder material 6 do not affect the part near the window glass plate 7. |
