| 摘要 |
<p>PURPOSE:To increase the general utility of a lead frame and to enhance an effect of the mass production by a method wherein an insulating resin film and additionally an electric-conductive metal thin-film formed on it are formed on the lead frame in such a way that they surround an island part. CONSTITUTION:A semiconductor device 1 is connected electrically to a lead frame by means of a metal thin-wire 2. In addition, an island 3 is connected electrically to a metal thin-film 5 formed on an insulating resin film 4 by means of a metal thin-wire 2'. A lead 6 required as a grounding pin is connected to the metal thin-film 5 by means of a metal thin-wire 2'', and functions as the grounding pin. Polyimide is suitable for the insulating resin material while a three-layer structure of copper + nickel + gold is suitable for the metal thin-film. The insulating resin film 4 is glued to the lead frame via an adhesive layer on its reverse face.</p> |
