发明名称 CARRIER TAPE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent inner leads from being displaced at the position and to prevent electrical and mechanical defects, such as the short-circuit of leads, insufficient connecting strength. and improper connection by securing the ends of the inner leads of leads onto an electrically insulating film. CONSTITUTION:Inner leads 5A of leads 5 are connected onto the tops of projecting electrodes 4. The outer leads 5B of leads 5 are connected to wirings 2. The leads 5 are regularly disposed and bonded on the surface of the first lead support of an electrically insulating film tape 6. The ends of the leads 5A are so regularly disposed on the lower surface of second lead supporting member (insulating film) 7 made of electrically insulating film 6 that the intervals of the leads become, for example, 80mum or 100mum, and bonded. The ends of the leads 5A of the leads 5 are regularly disposed on the lower surface of the member 7 to be bonded to secure the ends of the leads 5A at the time of forming a carrier tape. Accordingly, it can prevent the leads 5A from being deformed.
申请公布号 JPS63122131(A) 申请公布日期 1988.05.26
申请号 JP19860267534 申请日期 1986.11.12
申请人 HITACHI LTD 发明人 WAKASHIMA YOSHIAKI;KAWAGOE HIROHITO
分类号 H01L21/60 主分类号 H01L21/60
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