| 摘要 |
A cleaning apparatus according to the teachings of the present invention disclosure is shown in its most preferred form of a floor polishing machine having a polishing member rotatably mounted to a platform. The polishing member is raised off the floor surface by lift levers and lever extensions pivotally mounted to the chassis having their first ends pivotally mounted to the platform of the polishing member and their second ends pivotally attached to a vertically reciprocal rod biased by a spring. The polishing member automatically lowers due to the suction created by the polishing member forcing the air from underneath the center of the polishing member during rotation and against the bias of the spring. The rigid polishing member is allowed to follow the floor surface due to the pivotal mounting of the platform to the ends of the lift levers and to a parallelogram assembly. To control dust and debris, a vacuum chamber is provided surrounding the polishing member, with the vacuum being created by an impeller formed on and rotating with the polishing member and within a pressurizing chamber for drawing air out of the vacuum chamber and forcing it through a filtering dust bag. |
