| 摘要 |
PURPOSE:To prevent the exfoliation of thin films sticking to respective surfaces, at least the inside surfaces of deposition preventive surfaces to which the thin films are stuck by sputtering and to permit long-period continuous formation of the thin films by heating said surfaces with heaters during non-sputtering. CONSTITUTION:A voltage is impressed by a power supply 2 to a cathode 3 in a thin film forming chamber 1 the inside of which is evacuated to a vacuum to generate plasma between a target 4 on a cathode 3 and a substrate 7 disposed oppositely thereto to sputter the target 4, by which the thin film is formed on the substrate 7 surface. Heaters 8, 14 for heating the inside surfaces of the deposition preventive plates 5, a barrier surface 13 to which the thin films are stuck by sputtering are provided to the continuous type sputtering device of a load lock type constituted in the above-mentioned manner. The respective surfaces mentioned above are heated by using such heaters during non-sputtering so that the temp. difference from the temp. during the sputtering is decreased. The above-mentioned respective surfaces are preferably consisting of Al or Al alloy having the high adhesive force of the films, more particularly the Al or Al alloy the surfaces of which are subjected to sandblasting, etc.
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