发明名称 SUBSTRATE FOR HEAT DISSIPATION
摘要 PURPOSE:To easily manufacture the title substrate with an excellent heat dissipation property and a low thermal expansion coefficient by a method wherein the applicable basic material made of fiber comprising a low thermal expansion metallic material is impregnated with another metallic material with an excellent heat dissipation property. CONSTITUTION:A basic material is made of a fiber comprising a low thermal expansion metallic material impregnated with another metallic material with an excellent heat dissipation property. For example, first the basic material 1 is made of fiber comprising low thermal expansion metallic material. The applicable low thermal expansion metals are invar, W, Mo, etc., or C, SiC, etc., called half metal while the fiber of said metals contained in a metallic mold 5 is pressurized to be formed into the basic material 1 of a specified shape. Next, the basic material 1 is heated by a heaters to be impregnated with a metal bath 3 of Cu, etc., as an easily heated metallic material while being pressurized by a movable die 4 of the metallic mold 5. The normal fiber content of the impregnated basic material 1 is to be 20-80 volume %. Finally, impregnated basic material 1 is properly rolled in required thickness to be cut off in a specified shape.
申请公布号 JPS63120448(A) 申请公布日期 1988.05.24
申请号 JP19860266267 申请日期 1986.11.08
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 YAMADA SHUJI;KAWAMURA HIDEO
分类号 H01L23/14;H01L23/36 主分类号 H01L23/14
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