发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To decrease the number of positioning jigs and the number of soldered parts and to make insulating materials thin to the minimum degree as required, by using the insulating materials, which are fixed to a heat radiating metal plate by a flame coating method for electric insulation on between an electric circuit and the heat radiating metal plate. CONSTITUTION:Insulating materials 10a and 10b, which are fixed on a heat radiating metal plate 1 by a flame coating method, are used for electric insulation between an electric circuit and the heat radiating metal plate 1. At first, a positioning jig is placed on the beat radiating metal plate 1, on which the insulating materials 10 are fixed by the flame coating method. Solders 6c and 6d and electrode plates 3a and 3c are placed in the jig. A positioning jig is further placed thereon, and solders 6e and 6f and semiconductor elements 4a and 4b are placed in the jig. Then, the entire body is heated, and the solders 6c-6f are fused. Thereafter the solders are cooled and fixed. Thus even the thin insulating materials 10 become sufficiently rigid mechanically. Therefore, the insulating materials 10 can be made thin to the minimum degree as required.
申请公布号 JPS63119555(A) 申请公布日期 1988.05.24
申请号 JP19860266224 申请日期 1986.11.08
申请人 MITSUBISHI ELECTRIC CORP 发明人 KOGA EIJI
分类号 H01L23/40 主分类号 H01L23/40
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