| 摘要 |
PURPOSE:To form a stabilized crackless thin film having a non-steep stepping, giving no adverse effect on the process to be followed, and inflicting no bad influence on the base layer by a method wherein a film is formed by coating a liquid after a thin film has been deposited by performing an optical CVD method, or a thin film is deposited by performing an optical CVD method after a thin film has been formed by coating a liquid and applying heat. CONSTITUTION:A light is projected on the atom-containing raw gas of a thin film and a thin film is deposited, and after a liquid, which is formed by dissolving an Si compound into a solvent, has been coated thereon, a thin film is formed by applying heat. Instead of the above-mentioned method, the thin film may be deposited by projecting a light after the thin film has been formed by coating said liquid and applying heat. For example, an SiO2 film 2 is formed on a substrate 1 having recesses and projections using a CVD method, and after the liquid formed by dissolving an Si compound into a solvent has been coated thereon, SiO2 5 is formed by applying beat. Instead of this method, the SiO2 film 5 is formed by heating after the liquid, which is formed by dissolving the Si compound into a solvent, has been coated on the substrate having recesses and projections, and then an Si3N4 film 7 is formed using an optical CVD method. As a result, a flat, steep and stepless surfaced film can be formed on the substrate having roughened surface without inflicting adverse effect on the base layer.
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