| 摘要 |
PURPOSE:To eliminate production of solder refuse and avoid obstruction against a press work by a method wherein solder plating is applied to the die-bonding part of a lead frame beforehand and, further, silver plating with a specific thickness is applied to the solder plating. CONSTITUTION:In a lead frame for electronic components, the thickness of silver plating on solder plating is selected to be 0.1-0.5 mum. The thickness of the silver plating applied to the solder plating is related to the production of solder refuse. Moreover, the fact that the silver on the solder is diffused into the solder at the temperature for bonding silicon pellets is also related to the possibility of bonding the pellets without influence of the silver. The die-bonding part of a T0220 frame for transistors is coated with the solder plating 1 and the silver plating 2 of the present invention.
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