发明名称 PREPARATION OF LAMINATED STRUCTURE
摘要 <p>PURPOSE:To efficiently prepare a laminated structure having a beautiful cut surface without generating whitening phenomenon, by a method wherein a plurality of transparent synthetic resin plates each larger than a predetermined shape to be contacted with each other at a part to be cut thereof under pressure and, thereafter, laser beam is directed onto the laminate along a cutting line to apply the bonding and polishing finish of an end surface simultaneously with cutting. CONSTITUTION:A plurality of laminated synthetic resin plates 1 are pressed in an up-and-down direction and held between jigs 4 having a gap 4A along a cutting line and said jigs 4 are slid directly under the head 5 of a laser beam oscillator to perform cutting. By this method, a laminated structure having a light incident surface X, a light emitting surface Y, a long side A and a sheet side B is obtained but a molten part 1A is allowed to fill up the gaps between the transparent synthetic resin plates 1 at the cut part 6to mutually bond said resin plates 1. By this method, the whitening phenomenon generated at the cut part is suppressed, and the bonding and polishing finish of an end surface can be performed simultaneously with cutting.</p>
申请公布号 JPS63118237(A) 申请公布日期 1988.05.23
申请号 JP19860264928 申请日期 1986.11.07
申请人 MITSUBISHI RAYON CO LTD;MARUSHIN JUKO KK 发明人 KITAGAWA HIROSHI;SATO MASAAKI;KONDO KADOMASA;KOBAYASHI MASANAO
分类号 B29C65/74;B29C65/16;B29L9/00 主分类号 B29C65/74
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