发明名称 WIRE BONDING APPARATUS
摘要 PURPOSE:To obtain a wire bonding apparatus which can form a wiring part with uniform loop height and whose number of components is small by a method wherein a wire conduit for throttling the air is installed at the central part of a spool holder around which a wire is wound while an airtight space formed by the spool holder and its cover is evacuated to produce a vacuum. CONSTITUTION:During an operation an airtight space 31 is evacuated through a conduit 34 to produce a vacuum and is kept at a prescribed negative pressure; the air flows upward through an opening 12b at the lower end of a wire conduit 12, and flows into the inside of the airtight space 31 through an air discharge opening, i.e. an opening 12a at the upper part. A wire W located inside the conduit 12 is pulled upward by a sticky force of the ascending air. In addition, the wire located inside the airtight space 31 is lifted slightly upward by the air escaping from the opening 12a. Because the wire does not come into contact with a wire conduit 12c and a guide 11, it is possible to smoothly draw out the wire and to smoothly return it to a spool. In addition, even when the wire is apt to bend, it is immediately pulled up upward. As a result, it is possible to obtain its constant tension at all times.
申请公布号 JPS63117440(A) 申请公布日期 1988.05.21
申请号 JP19860264311 申请日期 1986.11.06
申请人 TOKYO SOKUHAN KK 发明人 KOYAMA MASAHIRO;GOTO KIKUO
分类号 B23K20/00;H01L21/60 主分类号 B23K20/00
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