| 摘要 |
PURPOSE:To enhance the reliability of the bonding of an electrode pad to a lead without increasing the number of production steps in such a way that a spare electrode pad whose function is the same as that of each electrode is formed on a substrate. CONSTITUTION:Electrode pads 7a-7e and spare electrode pads 9a-9e are connected electrically to circuit patterns 5; an electrode pad 7a has the same function as that of a spare electrode 9a. The spare electrode pads 9a-9e and the electrode pads 7a-7e are arranged at the respective positions which are symmetrical in relation to the central point C on a substrate 3. Leads 15 are bonded collectively to the electrode pads 7a-7e and the spare electrode pads 9a-9e; this assembly is mounted on a film carrier 11. During this process, there occurs a relative inclination between the film carrier 11 and a semiconductor chip 1 due to the difference in the parallelism, the existence of a minute foregn substance or the like. Even when, e.g., the position of the electrode pad 7a is shifted relatively in relation to the lead 15, the semiconductor chip 1 does not lose its intrinsic function because the spare electrode pad 9a and the electrode pad 7a located on the sides opposite to each other in relation to the central point are connected to the leads 15.
|
