| 摘要 |
PURPOSE:To provide the title compsn. which has excellent flame retardance, heat resistance and moldability and is useful as a laminating material for high- density multi-layer printed wiring boards, which has a low dielectric constant, containing a prepolymer composed of a specified poly(p-hydroxystyrene) derivative. CONSTITUTION:The title compsn. is obtd. by blending a prepolymer of a poly(p- hydroxystyrene) derivative (A) composed of a unit of the formula (wherein R is a 2-4C alkenyl or alkenoyl; l and m are each 1-4) [e.g., vinyl ether which is a reaction product of poly(p-hydroxystyrene) with ethylene oxide] with optionally not more than 50wt% prepolymer of a 1,2-polybutadiene derivative having unsaturated groups on its side chains. 100pts.wt. said compsn. is dissolved in an org. solvent (e.g., methyl ethyl ketone) and 0.1-10pts.wt. radical polymn. initiator (e.g., dicumyl peroxide) is added thereto to give impregnating varnish. A sheet substrate is coated with said varnish and dried at room temp. - 170 deg.C to give a prepreg. Predetermined sheets of prepregs are laminated and heated under a pressure of 1-100kgf/cm<2> at 100-250 deg.C to carry out a curing reaction, thus providing a laminated sheet. |
