发明名称 GASEOUS PHASE TYPE SOLDERING DEVICE
摘要 PURPOSE:To prevent a temperature drop at the time carrying a pre-heated work into a vapor phase, by providing a carrying-in port part heater between a cooling part provided on a work carrying-in port part and a work carrying path, in a vapor tank of a gaseous phase type soldering device. CONSTITUTION:A soldering device forms a saturated vapor phase 15 in the inside of a vapor tank 11, and executes reflow soldering to works 17, 18 which are pre-heated by a pe-heater of the outside, in a carrying path extending from a carrying-in port part 21 to a carrying-out port part 22. In such a case, by a condensing action of cooling parts 23, 24 provided on the carrying-in port part 21 and the carrying-out port part 22, it is prevented that the vapor phase 15 leaks out to the outside. Also, by a carrying-in port part heater 31 provided between the cooling part 23 and a work carrying path, the works 17, 18 are protected from a cooling action of the cooling part 23. In such a way, a temperature fall at the time when the work which is pre-heated by the outside is carried into the vapor phase can be prevented.
申请公布号 JPS63115677(A) 申请公布日期 1988.05.20
申请号 JP19860262417 申请日期 1986.11.04
申请人 TAMURA SEISAKUSHO CO LTD 发明人 ABE NOBUHIDE;TAKAHASHI TAKAO;HIRONO SHUNICHI
分类号 B23K1/015 主分类号 B23K1/015
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