发明名称 CREAM SOLDER
摘要 PURPOSE:To improve the tackiness retentivity after printing by incorporating >=1 kinds of compds. such as tributoxyethyl phosphate and trioctyl phosphate at a specific weight ratio into a pasty flux. CONSTITUTION:The compds. of at least one kind selected from the tributoxyethyl phosphate, trioctyl phosphate, dioctyl phosphate, and dibutyl diglycol adipate are incorporated into the components of the cream solder constituted of solder powder and the pasty flux. The cream solder is so constituted as to contain said compds. at >=10 pts. wt. per 100 pts. wt. pasty flux. Since the components of the tributoxyethyl phosphate, etc., impart the viscosity retentivity to the solder, the tackiness retentivity of the paste solder after the printing thereof is improved.
申请公布号 JPS63115693(A) 申请公布日期 1988.05.20
申请号 JP19860263509 申请日期 1986.11.04
申请人 ASAHI CHEM RES LAB LTD 发明人 IWASA SANDAI;OBA YOICHI
分类号 B23K35/22 主分类号 B23K35/22
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