| 摘要 |
PURPOSE:To secure the encapsulation of inert gas and an airtightness by a method wherein a rough part is provided in advance on the applying surface of an epoxy resin bonding agent hermetic sealing to be applied to the glass cap of a solid-state image pickup device. CONSTITUTION:A bonding agent 2 in which an epoxy resin, a curing agent and a filler are kneaded and dispersed is applied to a glass plate 1 by a screen printing method and a glass cap having an adhesion layer in a semihardened state is formed by heating. At this time, a rough part is provided on the applying surface of the bonding agent 2 for securing the path of inert gas to be encapsulated in a cavity, which is necessary at the time of adhesion of the glass cap to the opening part of a package. Then, the side surface of the bonding agent 2 of the glass cap are placed on the opening part of the ceramic package 5 with a solid-state colored image pickup element 8 housed therein, the adhesive surface is heated in a vacuum while being pressed, the layer of the bonding agent 2 is cured while nitrogen gas in encapsulated and a solid-state image pickup device is hermetically sealed. |
