| 摘要 |
<p>A film-forming resin composition comprising (A) from 1 to 10 weight percent of a phenolic resin, (B) from 10 to 89 weight percent of an epoxy resin and (C) from 10 to 89 weight percent of a reaction product between an epoxy resin and a phosphoric or phosphonic acid or monoalkyl orthophosphate, based on the total weight of (A), (B) and (C), is very useful for coating metallic substrates. The cross-linked composition gives colourless coatings of high toughness, flexibility, adhesion and chemical resistance.</p> |
