| 摘要 |
PURPOSE:To prevent the generation of crack in a die as well as to lessen the heat resistance on the periphery of a fixed layer by a method wherein the title lead frame is so contrived as to have together the function of relaxation of stress and the function of inhibition of heat resistance. CONSTITUTION:The stress to generate between a die attaching part 1 and a die 6 can weaken the rigidity of the die attaching part by the amount of the thickness made thinner of the die attaching part due to recessed places 11a and 11b formed on the upper and lower main surfaces of the die attaching part 1. As a result, the stress can be relaxed and the generation of crack in the die 6 of weak strength can be prevented. Moreover, as a coupled opening part 12 is formed by the upper and lower abutting, parts of the recessed places 11a and 11b, the gas to generate at the time of fixing of the die 6 with a fixing agent is discharged through the coupled opening part 12 and degassing can be performed. Therefore, the bubbles in a fixed layer 7 are reduced, and as a result the heat resistance on the periphery of the fixed layer can be lessened. In such a way, there is an effect to say that both functions of the function of lessening the generation of crack by relaxation of stress and the function of reducing heat resistance can be given.
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