| 摘要 |
PURPOSE:To use a semiconductor element without a bump electrode, and make it passible to exchange a defective element, by destructing selectively metal plating grain balls in a conductive adhesive agent in accordance with the difference of absorptivity of laser light between base material of the adhesive agent and resin balls. CONSTITUTION:Before an electrode pad on a semiconductor element 6 and the lead 3 of a wiring patten formed on a substrate 4 are bonded with conductive resin, a conductive adhesive agent 1 applying resin balls 2 plated with metal as a filler is spread in the form on a frame. After only the resin balls 2 in the conductive adhesive agent 1 in the part other than the lead part are destructed by a laser beam, a semiconductor element is subjected to positioning and joined. Thereby, low cost mounting is enabled, wherein an expensive semiconductor element with bump electrodes is not used, and a defective element can be easily removed only by heating.
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