| 摘要 |
PURPOSE:To prevent corrosion of a semiconductor chip due to moisture, by coating the surrounding parts of the semiconductor chip and an island part with a water repelling resin so as to cover the semiconductor chip. CONSTITUTION:A semiconductor chip 2 is fixed on an island part 1 of a lead frame with a bonding layer 3 comprising an epoxy silver paste bonding agent and the like. The surrounding parts of the island part 1 and the semiconductor chip 2 are coated with a water repelling resin 7 comprising fluorine or fluorine + Si by potting, splaying and the like. The semiconductor chip 2 and leads 4 are wired with Au wires 5. Then the part of the semiconductor chip 2 is seal with epoxy or silicone resin 6. Thus intrusion of moisture into the semiconductor chip can be positively prevented, and corrosion of the semiconductor chip can be prevented. |
