| 摘要 |
PURPOSE:To improve the retaining property and the heat transfer property of a semiconductor chip, by connecting the semiconductor chip and a wiring board with leads leaving polyimide in a melt state, and making polyimide adhere to both of them after caking the polyimide melt. CONSTITUTION:Polyimide melt 12 is dripped on a wiring board 5 on which a part 51 to prevent flowing out is arranged. After a semiconductor chip 1 and wiring substrate 3 are connected with leads, the polyimide melt 12 is caked, and made to adhere to both of the semiconductor chip 1 and the polyimide 12. Thus the polyimide 12 adheres to both of the semiconductor chip 1 and the wiring board 5, and the thickness of polyimide 12 becomes uniform. Further, the semiconductor chip 1 is hold by the polyimide 12, so that the retaining property and the heat transfer property through polyimide are improved.
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