| 摘要 |
PURPOSE:To secure the area for a pad, increase the degree of integration, and reduce the size of a chip, by arranging a bonding pad at least on an element region, and using wireless bonding. CONSTITUTION:The bonding area of an element 30 which is capable of wireless bonding of face down system by flip chip method is not present in the outer peripheral part the an element 30, but an electrode 31 (bonding pad) is arranged in the form of a matrix on an element region or an active region by applying a multilayer interconnection structure. As the bonding area (pad) 31 is arranged on the element region in such a manner, the area for a pad can be effectively secured, the degree of integration can be increased by that amount, and the size of a chip can be remarkably reduced. |
