| 摘要 |
A photosensitive laminate (L,L') is produced by laminating a photoresist layer (3), an intermediate film (2) adhered thereto comprising from 10 to 100wt% of carboxylated polyvinyl alcohol and 0.90wt% of hydroxyethyl cellulose, and a support sheet (1) of a material which adheres to the intermediate film but with relatively less adhesion than that between the intermediate film and the photoresist layer. Such laminates can be applied to one or both sides of a metal-clad substrate (5) for a printed circuit board for the production of a circuit pattern thereon by patterned irradiation and subsequent development. |
