| 摘要 |
PURPOSE:To effectively avoid defect of the quality of a semiconductor device due to failure of the cutting of suspension pins and to contrive the improvement of the yield of a product by performing the cutting of the suspension pins by rotary cutters. CONSTITUTION:A lead frame 17 of an intermediate structure of a semiconductor device, such as an intermediate structure 12 of a miniflat type semiconductor device, is pinched between a top force 10 and a bottom force 11. Discal rotary cutters 14a and 14b are arranged over suspension pins 13a and 13b protruding from the side end surfaces of a resin molded part 12a. After the coupling parts and tie bar parts of this intermediate structure 12 are cut, the exposed base parts of the suspension pins 13a and 13b are cut by the disk cutters 14a and 14b to rotate at high speed. In this example, air turbine motors 15 can be utilized as driving means for the disk rotary cutters 14a and 14b, but besides these, electricallydriven motors and so on can be used.
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