| 摘要 |
PURPOSE:To make it possible for side edge parts of each additional electrode to be subjected to thermocompression bonding to the metalized layer of each dielectric substrate layer in a short time, by using an assembling jig whose press surface is made long. CONSTITUTION:An assembling jig 13 whose press surface 13a is made long as shown in figure is used, instead of an assembling jig having a press surface in the form of a several tens of micron diameter circle. Side edge parts of each additional electrode 3a-3c can be subjected to thermocompression bonding in the manner in which an amount corresponding to the length of the press surface is simultaneously finished in every operation. Thereby, the work time of assembling a device can be reduced. As the result, the thermal effect on a chip 1 is decreased, and its deterioration can be prevented.
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