| 摘要 |
PURPOSE:To reduce the time for heating and hardening an adhesive agent after a chip is tentatively fixed on a substrate, by preheating a jig, a substrate, and the adhesive agent with a preheater while a jig is positioned at a chip supply device and chips are supplied on a substrate. CONSTITUTION:The title equipment is provided with the followings. A coater 4 of adhesive agent spreads an adhesive agent on the chip arrangement position of a substrate 8 retained on a jig 2 along a transferring path 1 of the jig 2 which retains the substrate 8 and the chip 15 regulating their positions. A chip supply device 5 supplies a chip 15 at a specified position on the substrate 8. A heating oven 6 heats and hardens the adhesive agent between the substrate 8 and chip 15 whose positions are regulated on the jig 2, and finally fixes the chip 15 on the substrate 8. A preheater 19 preheats the jig 2 positioned at the chip supply equipment 5. When supplying the chip 15 is finished, and the chip 15 and the substrate 8 are into the oven 6 together with the jig 2, in order that the jig 2, the substrate 8, and the adhesive agent are preheated, the heating of the adhesive agent is quickly progressed up to a hardening temperature. Thereby, time necessary for hardening the adhesive agent in the heating oven can be reduced.
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