PACKAGE AND ASSEMBLING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME

摘要

PURPOSE:To effectively attach a pellet having high reliability by thermally press-bonding a metal foil on the pellet mounting position on a substrate substantially entirely. CONSTITUTION:A metallized layer 5 (a conductive layer) is composed of a tungsten layer 6, a nickel layer 7 and a gold layer 8 on the upper surface of a package substrate 1. A metal foil 9 made of gold is thermally press-bonded on the layer 5 of the pellet mounting position at the center of the substrate 1, and air gap is not allowed to remain between the back surface of the foil 9 and the upper surface of the gold 8. When a semiconductor pellet 10 is mounted on the foil 9, the back surface of the pellet is not effectively pelletized without air bubbles or incomplete pelletizing region or metal chips, thereby obtaining high reliability.