发明名称 ULTRA-PRECISE POLISHING ABRASIVE MATERIAL
摘要 PURPOSE:To make it possible to rapidly obtain a polished surface with no scratches, by forming an ultra-precise polishing abrasive material from spherical ultramicro particle-like beta type polycrystal silicon carbide having an averaged particle size of 0.01 to 1 mum, which is the aggregate of heat-treated beta type silicon carbide. CONSTITUTION:An ultra-precise polishing abrasive material is formed of spherical ultramicro particle-like beta type polycrystal silicon carbide having an averaged particle size of 0.01 to 1 mum, which is the aggregate of heat-treated beta type silicon carbide. In this case, it is preferable that the crystallite normally has greater than about 50 angstroms. Such ultramicro particle-like beta type silicon carbide is obtained from organic silicon carbide in which at least one identicalsSiH bond exists in one molecule but no SiX (X is halogen atoms or oxygen atom) bond exists, such as a methyl hydrogen silane compound, which is subjected to a vapor phase cracking process at a temperature of about 750 deg. C, and is then heat-treated at the temperature of 1,000 to 2,000 deg. C. Thus, it is possible to rapidly obtain an excellent polished surface with no scratches.
申请公布号 JPS63114865(A) 申请公布日期 1988.05.19
申请号 JP19860256848 申请日期 1986.10.30
申请人 SHIN ETSU CHEM CO LTD 发明人 TERAJIMA ISAO;MATSUMOTO KOICHI;MOTOMIYA TATSUHIKO;URASATO NOBUAKI;OSAKI HIROMI
分类号 B24B37/00;C01B31/36 主分类号 B24B37/00
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