发明名称 Cooling module for use in a circuit board installation
摘要 A thermally conductive module for locally extracting heat from an individual electrical component of a circuit board installation comprises a tubular metal housing 1 of high thermal conductivity closed at one end 2 and having at that end a screw-threaded stud 12 for securing the housing to and in thermal contact with a thermal conductor. A spring-loaded metal piston 4 of high thermal conductivity is slidably mounted in the bore 3 of, and protrudes from, the housing 1 and has a throughbore 8 opening into the exposed end face 9. A grease-like medium 10 of high thermal conductivity is contained in the closed bore 3 of the housing 1. When the housing 1 is secured in thermal contact with a thermal conductor and the exposed end face 9 of the piston 4 is brought into thermal contact with an electrical component from which heat is to be extracted, the piston is urged against the action of its associated coil spring 6 and grease-like medium 10 exudes from the throughbore 8 and flows between the exposed end face 9 of the piston and the electrical component to provide an effective thermal contact therebetween. <IMAGE>
申请公布号 GB2197538(A) 申请公布日期 1988.05.18
申请号 GB19870024682 申请日期 1987.10.21
申请人 * BICC PUBLIC LIMITED COMPANY 发明人 DAVID * HORNE
分类号 H01L23/36;H01L23/40;H05K7/20 主分类号 H01L23/36
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